Currently there are several special issues in “Data Envelopment Analysis Journal”, see details below.

Manuscript Preparation /submission:

Please refer to the Journal Information and Instructions for Author about manuscript preparation: http://www.nowpublishers.com/Journal/AuthorInstructions/DEA

 

Data Envelopment Analysis Journal

Special issue on
Efficiency in Financial Institutions

Guest editors:

Subhash C Ray, University of Connecticut, Storrs, CT USA
Hirofumi Fukuyama, Fukuoka University, Fukuoka, Japan
Submission Deadline: April 30, 2018

Data Envelopment Analysis Journal

Special issue on

Measurement of Performance in Emerging Economies and Middle Income Countries

Guest editors:

Ali Emrouznejad, Aston Business School, Birmingham, UK
Subhash C. Ray, University of Connecticut, Storrs, CT USA
Nurhan Davutyan, Kadir Has University, ?stanbul, Turkey.
LI Yongjun, University of Science and Technology of China

Submission Deadline: March 31, 2018

Data Envelopment Analysis Journal

Special issue on

Stochastic Frontiers

Guest editors:

Ole Olesen, University of Southern Denmark. ole@sam.sdu.dk
Chris Parmeter, University of Miami, cparmeter@bus.miami.edu
John Ruggiero, University of Dayton, jruggiero1@udayton.edu

Submission Deadline: December 31, 2017

 

Data Envelopment Analysis Journal

Special issue on

Measurement of Environmental Efficiency

Guest editors:

Subhash C. Ray, University of Connecticut, Storrs, CT USA
Ali Emrouznejad, Aston Business School, Birmingham, UK
Kankana Mukherjee, Babson College, Wellesley, MA, USA

Submission Deadline: March 31, 2018

Data Envelopment Analysis Journall

Special issue on
Efficiency Analysis for Manufacturing and Engineered Systems

Guest editors:

Konstantinos Triantis, Virginia Tech, Industrial and Systems Engineering, VA, USA
Andrew Johnson, Texas A&M, Industrial and Systems Engineering, Texas, USA
Saeideh Fallah-Fini, Cal Poly Pomona, Industrial and Manufacturing Engineering, USA


Submission Deadline: January 15, 2018

Data Envelopment Analysis Journal

Special issue on

Transportation and Logistics insights through

Guest editors:

Ole Olesen, University of Southern Denmark. ole@sam.sdu.dk
Nicole Adler, The Hebrew University of Jerusalem, Israel. msnic@huji.ac.il
Bo Zou, University of Illinois at Chicago, USA. bzou@uic.edu

Submission Deadline: December 30, 2017